Thermal Transient Analysis

T3Ster® (pronounced "Tris-ter") is an advanced thermal tester for thermal characterization of IC packages, LEDs and systems producing extensive thermal characteristics rapidly. T3Ster is a consistent set of testing hardware and software, it is aimed at dynamic thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs), stacked die and other multi-die devices.


 

TeraLED is to obtain combined optical/thermal measurements, T3Ster measures the thermal response of the LED under test. The photometric and radiometric characterization are performed by TeraLED. The measured emitted optical power then is considered by T3Ster when calculating the thermal metrics of the LED under test and light output characteristics shown by TeraLED are provided as a function of the real junction temperature. A selection of 30- and 50cm diameter integrating spheres is offered to host temperature controlled DUT holder fixture solutions.

DynTIM is a high-precision test environment for both standalone materials and in-situ and is designed to operate in conjunction with T3Ster®, Mentor’s leading thermal transient testing solution. The system is mainly designed for the measurement of soft materials, such as thermal greases and compressible pads. Adhesives and solid samples can also be tested.


 

Power Tester 1500A tests the reliability of power electronic components that are increasingly used in industries such as automotive and transportation including hybrid and electrical vehicles and trains, power generation and converters, and renewable energy applications such as wind turbines. It is the only commercially available thermal testing product that combines both power cycling and thermal transient measurements with structure function analysis while providing data for real-time failure-cause diagnostics. Common thermally-induced mechanical failures that the Power Tester 1500A analyzes in "real time” include die-attach wire bond separations, die and package stack-up delamination and cracks, and solder fatigue.